RELE 2022 New 20g BGA Syringe Tin Solder Paste Leaded Sn63/Pb37 Melting Point 183℃
Sale price USD $14.95 Regular price USD $19.95
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Sale price USD $14.95 Regular price USD $19.95
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SMART DESIGN
New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.
PCB/BGA DEDICATED
High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.
WIDELY APPLICABLE
The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance. Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.
REVOLUTIONARY DURABILITY
Wetting, anti-dry, relatively long shelf life at room temperature. Unique high-quality solder paste, fine and flexible packaging (10 cc/support), delicate appearance.
🎁It's a perfect gift for your family!
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RELE 2022 New 20g BGA Syringe Tin Solder Paste Leaded Sn63/Pb37 Melting Point 183℃
Sale price USD $14.95 Regular price USD $19.95
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